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New Quantum Fabrication Tools in 4D LABS
4D LABS is pleased to announce the availability of 4 new tools thanks to support from PacifiCan! These are available now in NEMO, along with their SOPs. Please contact us for more information, training and/or contract work.
Dicing Saw: A fully enclosed system capable of dicing up to 8"/200mm wafers. Features include a new vision system for wafer alignment, multiple cutting modes with a high-end water cleaning system.
HMDS oven: Used to improve resist adhesion on wafer surfaces, capable of handling up to 8"/200mm wafers, automated recipes for HMDS deposition.
Spin Rinse Dryer (SRD): Used for rinsing and drying wafers, primarily after RCA cleaning. It is capable of handling up to 8"/200mm wafers.
Plasma stripper: This tool is capable of handling up to 8"/200mm wafers and features an automated recipe control.
Stay tuned - We have more systems coming in over the next few months!