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Laser micromachining
The IPG-280 laser workstation employs two separate lasers and beam delivery systems allowing for a high degree of flexibility for process development activities.
1. Excimer laser (deep UV) is ideal for micromachining a very wide variety of materials like glass.
- 193nm /ArF Excimer Laser Configuration and maximum Pulse Energy - 9mJ
- Beam Dimensions (WxH) - 2mm x 6mm
- Pulse duration (FWNH) 5 – 15 ns (Typically 10 ns) and Pulse Repetition Rate 0 – 1000 Hz
2. High Power QCW laser is used for thicker material cutting and drilling.
- High Pulse Energy Configuration Optimized for high speed drilling operations.
- Wavelength – 1070nm
- Power 300W Max Average Power / Peak Power 3000 W Max Peak Power
- Pulse Width 0.2 – 50 ms
Tool Specs
Manufacturer | IPG |
---|---|
Model | IX-280-ML |
Typical Application | Micromachining and Cutting |
Location | 6072 |
Related Documents | Standard Operating Procedure |
Training Contact | info@4dlabs.ca |
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