PVD 1

  • Thermal: 2 sources available, currently not occupied.
  • E-beam: Ni, Cr, Al, Ti
  • RF Sputter: Al2O3
  • DC Sputter: Ni, Al, Al/Si, Cr, Ti
  • Sources: 2 thermal, 4 e-beam, 2 DC sputter (1 source for ferromagnetic materials), 2 RF sputter
  • 5E-7 Torr base pressure
  • Processing for small pieces, 50 and 100 mm wafers

Tool Specs

Manufacturer Bestec
Typical Application Metal deposition
Location 6060.8
Related Documents

Standard Operating Procedure

Training Contact info@4dlabs.ca