4D LABS Workshop - Vacuum Science and PVD

August 23, 2018
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We are pleased to invite you to two courses presented on August 23rd by Kurt J Lesker Company!  The first course starts at 8am and will cover vacuum science and system design.  The second course starts at 1pm and covers physical vapor deposition and thin film growth models.

Date: Thursday, August 23, 2018

Time: 9:00 am - 5:00 pm

Location: AQ3149, SFU Burnaby

Lunch is provided for registered attendees

Please register for this workshop by completing the following survey: http://websurvey.sfu.ca/survey/321031048

1. Introduction to Vacuum Science and System Design (9am-12pm)
This class is designed to introduce the student to basic concepts in vacuum technology. Subjects covered include molecular density in vacuum, the ideal gas law, molecular flow in various vacuum regimes, characteristics of gas composition at various molecular densities, general principles of gas-solid interactions, vacuum pump technology and the impact of fundamental design decisions and operating practices on vacuum system performance. It is intended for people who are new to vacuum or may not have any formal training. It also provides a general review for those who have had some formal training in vacuum technology. The student should achieve a general understanding of vacuum technology as a foundation for further training in vacuum system design and thin film deposition. This course also includes several short quizzes to better enable the learning process. Students who attend the class can receive a personalized certificate of attendance signed by the course instructor.

Specific topics include:
a. Technical resources for vacuum technology
b. Pressure and molecular density
c. Adsorption, Desorption, Diffusion and Permeation
d. Gas–Solid Interactions
e. Flow Regimes
f. Conductance
g. Vacuum Pump Technologies, Pumping Speed and Pump Throughput
h. Detecting leaks in vacuum systems
i. Pressure measurement in vacuum
j. Valves and Seals for high and ultra-high vacuum
k. Gas Load
l. Effects of humidity on vacuum system performance
m. Outgassing
n. Surface finishes for vacuum applications
o. Calculations of ultimate base pressure of a vacuum system

2. Physical Vapor Deposition and Thin Film Growth Models (1pm-5pm)
This class is designed to introduce the student to fundamental concepts and operating principles for the deposition of thin films by thermal and e-beam evaporation as well as sputtering by DC and RF techniques. It includes a recap of basic vacuum technology, followed by fundamental design and operational aspects of each thin film deposition technique as it impacts thin film properties. Issues such as deposition rate, film uniformity, morphology and density are discussed. Several growth models are presented with reference to how specific materials properties and deposition conditions may affect thin film morphology. The student should achieve a general understanding of thin film deposition by physical vapor techniques and be familiarized with available resources for further training. This course also includes several short quizzes to better enable the learning process. Students who attend the class can receive a personalized certificate of attendance signed by the course instructor.

Specific topics covered include:
a. Introduction
b. References on thin film deposition technologies
c. Introduction to basic vacuum
d. Depositing thin films by:
        a. Thermal evaporation
        b. E-beam evaporation
        c. Sputtering by Direct Current (DC) Magnetron
        d. Sputtering by Radio Frequency (RF) Magnetron
        e. Sputtering using pulsed processes – i.e. HiPIMs
        f. Cathodic Arc Deposition (if there is interest)
e. Thin Film Growth Models
        a. Layer Growth
        b. Island Growth
        c. Combined Layer and Island Growth
        d. The Structure Zone model(s)
f. Effects of Deposition Conditions on Film Characteristics, including:
        a. Stress in thin films
        b. Thickness effects
        c. Effect of Chamber Pressure on film properties
        d. Deposition rate and film characteristics
g. Enhanced Deposition Techniques
        a. Combinatorial Magnetron Sputtering
        b. Glancing Angle Deposition
        c. Atomic layer deposition