Wafer scriber

The tempress wafer scriber uses a diamond tip to vertically scratch a surface.  This technique can be used to accurately define where a wafer will be cleaved.  The system will keep the tip elevated as it moves towards the user, and then descends and scribes the surface as it move away from the user.  The maximum scribe length is 50 mm.  The force can be varied as needed.

Tool Specs

Model 1713-10C
Typical Application Scribing silicon or glass wafers
Location 6060.2
Related Documents Standard Operating Procedure