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The tempress wafer scriber uses a diamond tip to vertically scratch a surface. This technique can be used to accurately define where a wafer will be cleaved. The system will keep the tip elevated as it moves towards the user, and then descends and scribes the surface as it move away from the user. The maximum scribe length is 50 mm. The force can be varied as needed.
|Typical Application||Scribing silicon or glass wafers|
|Related Documents||Standard Operating Procedure|