RIE 1 - chlorine

  • Etching of metals, nitrides, and III/V compounds with Cl2/BCl3
  • Etching of polysilicon and silicon with Cl2
  • Automated loading and unloading of wafers
  • Resist stripping or ashing with O2
  • Processing for small pieces, 50 and 100 mm wafers
  • Vacuum load lock with automated wafer loading

Tool Specs

Manufacturer Sentech
Model SI 591
Typical Application Metal and III-V etching
Location 6060.6
Related Documents

Standard Operating Procedure

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