RIE 1 - chlorine

• Etching of metals, nitrides, and III/V compounds with Cl2/BCl3
• Etching of polysilicon and silicon with Cl2
• Automated loading and unloading of wafers
• Resist stripping or ashing with O2
• Processing for small pieces, 50 and 100 mm wafers
• Vacuum load lock with automated wafer loading
  

Tool Specs