PVD 1

• Thermal: 2 sources available, currently not occupied.
• E-beam: Ni, Cr, Al, Ti
• RF Sputter: Al2O3
• DC Sputter: Ni, Al, Al/Si, Cr, Ti
• Sources: 2 thermal, 4 e-beam, 2 DC sputter (1 source for ferromagnetic materials), 2 RF sputter
• 5E-7 Torr base pressure
• Processing for small pieces, 50 and 100 mm wafers

Tool Specs