Nanoimprinter

Sample holder for one 4” wafer, wafer fragments or diced wafers

 - Thermal, photocurable nanoimprinting and embossing using an air cushion press (ACP) system

 - Ultra-uniform, low lateral stress, and low damage to the mold and substrate

 - Embossing pressure up to 500psi

 - Maximum Temperature of 250°C with heating Rate of 300°C/min and cooling Rate of 150°C/min

 - Mercury UV lamp for the exposure of UV-curable resist

Tool Specs