Dicing saw

The Loadpoint MicroAce Series 3 is an ultra-high – precision, high speed cutting and scribing machine.

• A wide range of materials can be cut including Silicon, Ferrite, Glass, Germanium and PZT up to 6 inch in diameter.
• Wafer size: 2" to 6"
• An air bearing work table with feed rate from 0.1 mm/sec upwards
• DC servo motor with X and Y slideways accurate to within 2 microns for flatness and straightness.
• Programmable Cutting speed from 3000 to 40000 rpm
• Ability to precise align the work piece and the cut

Tool Specs