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New Tools in 4D LABS
March 29, 2019
4D LABS is pleased to announce the availability of new tools thanks to funding from Western Economic Diversification Canada! The following tools are now available for training and contract work:
- Deep Reactive Ion Etcher: Etching of high-aspect ratio structures in silicon, including very deep etches. Processing of 6” wafers or smaller substrates on a carrier wafer.
- Mask Aligner: Semi-automated aligner with LED UV light source. Processing of wafers up to 6” including automatic alignment capabilities.
- Wafer Bonder: Bonding of various substrates or thermal embossing. Up to 6” wafers with alignment capabilities.
These new tools will allow full processing for up to 6” wafers in 4D LABS. The SOPs for these tools are available and we have recipes for training and initial process development.
If you have any questions or would like to schedule training, please don’t hesitate to contact us.