Fabrication Capabilities
- Photolithography
- positive and negative tone resist processing
- deep UV, i-line and g-line exposure
- mask-to-wafer alignment capabilities
- contact and non-contact modes of exposure
- Direct Write Laser Lithography
- positive and negative tone resist processing
- i-line exposure using a diode laser
- grey scale and 3D lithography capabilities
- patterning over areas up to 4"x4"
- 1 µm minimum feature size
- Maskless Laser Lithography
- positive tone resist processing
- h-line exposure using a diode laser
- fabrication of photolithographic masks
- standard processes include 4"x4" and 5"x5" masks
- 600 nm minimum feature size
- Electron Beam Lithography
- positive and negative tone resist processing
- variable sample sizes up to 5" wafers
- mask writing capabilities
- patterning of nanoscale features
- Robotic Lithography Tool
- class 1 environment available
- multilayer process capabilities
- complex programs possible
- processes include material deposition, exposure, and developing
- Soft Lithography
- pattern transfer by replication or imprinting
- fabrication by selective material transfer
- resist patterning and fabrication by contact printing
- patterning of molecules and/or materials
- Selective Wet Etching Processes
- wet etching tecnhiques
- photoresist developing or removal
- etching of oxides or metals
- etching of silicon and III-IV semiconductors
- Selective Dry Etching Processes
- chlorine and fluorine-based etching
- etching of oxides, metals, and semiconductors
- oxygen plasma cleaning
- removal of organic residues
- surface cleaning capabilities
- Chemical Vapour Deposition
- thermal process furnaces
- poly-silicon deposition
- silicon oxide growth
- silicon nitride deposition
- diffusion furnace
- n-type semiconductor doping
- plasma enhanced deposition
- silicon oxides and silicon nitrides growth
- low temperature deposition
Epitaxial Growth of Materials
- metal and oxide deposition
- growth of single crystalline films
- homogeneous or periodic structures growth
- Physical Vapour Deposition
- DC/RF sputtering
- electron beam deposition
- thermal evaporators
- materials include metals, oxides, and semiconductors (contact us for further details)
- capabilities include deposition of alloys and multilayered films
- Bulk Crystal Growth
- single crystal growth
- materials include ferroelectrics
- Rapid Thermal Processing
- programmable heating
- oxidation, inert gas, and forming gas processes
- Optical Microscopy
- reflection and transmission modes of imaging
- optical filters permit imaging of photosensitive materials
- Spectroscopic Ellipsometry
- analysis of refractive index and dielectric constant of thin films
- film thickness measurements
- non-destructive technique
- Surface Prolifometry
- physical measure of topography
- analysis of nano- to micron-scale thicknesses
- Thin Film Stress Analysis
- measure of stress in CVD and PVD grown films
- Contact Angle Goniometer
- measure of interfacial energies
- dynamic contact angle analysis
- capable of automated measurements
- Probe Station
- electrical materials characterization
- semiconductor parameter analysis
- CMOS, BJT, and HBT wafer probing
- analysis of nano-scale electronic devices
- Wire Bonding Station
- formation of electrical contacts to structures and/or devices
- contacts include gold and aluminum wires
- wedge-wedge and ball-wedge bonding available
