S
Scanning Electron Microscopy
- imaging of physical surface structures
- rapid elemental imaging
- chemical analysis
Scanning Probe Microscopy
Scanning Tunneling Microscopy
Secondary Ion Mass Spectroscopy
- chemical analysis of surfaces by ion sputtering
- depth profiling of composition
Selective Wet Etching Processes
- wet etching tecnhiques
- photoresist developing or removal
- etching of oxides or metals
- etching of silicon and III-IV semiconductors
Selective Dry Etching Processes
- chlorine and fluorine-based etching
- etching of oxides, metals, and semiconductors
- oxygen plasma cleaning
- removal of organic residues
- surface cleaning capabilities
Soft Lithography
- pattern transfer by replication or imprinting
- fabrication by selective material transfer
- resist patterning and fabrication by contact printing
- patterning of molecules and/or materials
Spectroscopic Ellipsometry
- analysis of refractive index and dielectric constant of thin films
- film thickness measurements
- non-destructive technique
SQUID (Superconducting Quantum Interference Device)
- magneto-resistance measurement capabilities
- variable temperature analysis (1.8 to 800 K)
- capable of AC mode measurements
- optional optical illumination of samples
Surface Plasmon Resonance Spectroscopy
- measure of changes in surface dielectric layers on gold
- dynamic measure of adsorption and desorption rates from surfaces
Surface Profilemetry
- physical measure of topography
- analysis of nano- to micron-scale thicknesses
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