P
Particle Size Analysis
- measure of particle size distribution
- capable of measuring particles down to 2 nm in diameter
Photoemission and Low Energy Electron Microscopy
Photolithography
- positive and negative tone resist processing
- deep UV, i-line and g-line exposure
- mask-to-wafer alignment capabilities
- contact and non-contact modes of exposure
Physical Vapour Deposition
- DC/RF sputtering
- electron beam deposition
- thermal evaporators
- materials include metals, oxides, and semiconductors (contact us for further details)
- capabilities include deposition of alloys and multilayered films
R
Rapid Thermal Processing
- programmable heating
- oxidation, inert gas, and forming gas processes
Robotic Lithography Tool
- class 1 environment available
- multilayer process capabilities
- complex programs possible
- processes include material deposition, exposure, and developing
