Analytical Capabilities
Scanning Electron Microscopy
- imaging of physical surface structures
- rapid elemental imaging
- chemical analysis
Transmission Electron Microscopy
- elemental analysis
- analysis of nanoscale crystalline materials
- high resolution imaging of crystalline lattices
Photoemission and Low Energy Electron Microscopy
Scanning Probe Microscopy
Scanning Tunneling Microscopy
Atomic Force Microscopy
- mapping of physical topography
- localized measure of electrostatic and magnetic forces
- analysis of work function differences
- electrical characterization of nano-scale features
Near-field Scanning Optical Microscopy
- localized optical absorption measurements
- nano-scale optical emission
Optical Microscopy
- reflection and transmission modes of imaging
- fluorescence imaging
- temperature dependent imaging
X-Ray Photoelectron Spectroscopy
- chemical state and bonding information
- quantitative information
- elemental mapping of surfaces
Auger Electron Spectroscopy
- surface sensitive elemental distribution maps
- capable of depth profiling using ion sputtering
- physical imaging of a surface
Ion Scattering Spectroscopy
- Surface sensitive spectroscopy
- complimentary information to SIMS
Secondary Ion Mass Spectroscopy
- chemical analysis of surfaces by ion sputtering
- depth profiling of composition
Energy Dispersive X-Ray Spectroscopy
- elemental mapping of thin films and nanostructures
- semi-quantitative analysis
Electron Energy Loss Spectroscopy
- atomic composition measurements
- chemical bonding and oxidation state information
- valence and conduction band electronic properties
Surface Plasmon Resonance Spectroscopy
- measure of changes in surface dielectric layers on gold
- dynamic measure of adsorption and desorption rates from surfaces
Optical Spectroscopy
Spectroscopic Ellipsometry
- analysis of refractive index and dielectric constant of thin films
- film thickness measurements
- non-destructive technique
Morphology
Particle Size Analysis
- measure of particle size distribution
- capable of measuring particles down to 2 nm in diameter
X-ray Diffraction
- crystallinity and phase composition determination
- size determination of crystallites
- polycrystalline and single crystalline samples
- analysis of thin films, bulk solids, or powders
Surface Profilemetry
- physical measure of topography
- analysis of nano- to micron-scale thicknesses
Additional Techniques
Microcalorimetry
Thin Film Stress Analysis
- measure of stress in CVD and PVD grown films
Contact Angle Goniometer
- measure of interfacial energies
- dynamic contact angle analysis
- capable of automated measurements
SQUID (Superconducting Quantum Interference Device)
- magneto-resistance measurement capabilities
- variable temperature analysis (1.8 to 800 K)
- capable of AC mode measurements
- optional optical illumination of samples
MOKE (Magneto-Optic Kerr Effect measurement system)
Lithographic Processes
Photolithography
- positive and negative tone resist processing
- deep UV, i-line and g-line exposure
- mask-to-wafer alignment capabilities
- contact and non-contact modes of exposure
Direct Write Laser Lithography
- positive and negative tone resist processing
- i-line exposure using a diode laser
- grey scale and 3D lithography capabilities
- patterning over areas up to 4"x4"
- 1 µm minimum feature size
Maskless Laser Lithography
- positive tone resist processing
- h-line exposure using a diode laser
- fabrication of photolithographic masks
- standard processes include 4"x4" and 5"x5" masks
- 600 nm minimum feature size
Electron Beam Lithography
- positive and negative tone resist processing
- variable sample sizes up to 5" wafers
- mask writing capabilities
- patterning of nanoscale features
Robotic Lithography Tool
- class 1 environment available
- multilayer process capabilities
- complex programs possible
- processes include material deposition, exposure, and developing
Soft Lithography
- pattern transfer by replication or imprinting
- fabrication by selective material transfer
- resist patterning and fabrication by contact printing
- patterning of molecules and/or materials
Etch Processes
Selective Wet Etching Processes
- wet etching tecnhiques
- photoresist developing or removal
- etching of oxides or metals
- etching of silicon and III-IV semiconductors
Selective Dry Etching Processes
- chlorine and fluorine-based etching
- etching of oxides, metals, and semiconductors
- oxygen plasma cleaning
- removal of organic residues
- surface cleaning capabilities
Deposition Processes
Chemical Vapour Deposition
- thermal process furnaces
- poly-silicon deposition
- silicon oxide growth
- silicon nitride deposition
- diffusion furnace
- n-type semiconductor doping
- plasma enhanced deposition
- silicon oxides and silicon nitrides growth
- low temperature deposition
Epitaxial Growth of Materials
Molecular Beam Epitaxy
- metal and oxide deposition
- growth of single crystalline films
- homogeneous or periodic structures growth
Physical Vapour Deposition
- DC/RF sputtering
- electron beam deposition
- thermal evaporators
- materials include metals, oxides, and semiconductors (contact us for further details)
- capabilities include deposition of alloys and multilayered films
Bulk Crystal Growth
- single crystal growth
- materials include ferroelectrics
Rapid Thermal Processing
- programmable heating
- oxidation, inert gas, and forming gas processes
Process Characterization
Optical Microscopy
- reflection and transmission modes of imaging
- optical filters permit imaging of photosensitive materials
Spectroscopic Ellipsometry
- analysis of refractive index and dielectric constant of thin films
- film thickness measurements
- non-destructive technique
Surface Prolifometry
- physical measure of topography
- analysis of nano- to micron-scale thicknesses
Thin Film Stress Analysis
- measure of stress in CVD and PVD grown films
Contact Angle Goniometer
- measure of interfacial energies
- dynamic contact angle analysis
- capable of automated measurements
Probe Station
- electrical materials characterization
- semiconductor parameter analysis
- CMOS, BJT, and HBT wafer probing
- analysis of nano-scale electronic devices
Wire Bonding Station
- formation of electrical contacts to structures and/or devices
- contacts include gold and aluminum wires
- wedge-wedge and ball-wedge bonding available
